TESCAN | AI-Assisted TEM Lamella Prep Automation with Automated Lift-out
Monday, July 29, 2024
5:45 PM - 6:45 PM US EST
Location: Exhibit Hall BC
Booth 521
This demonstration will show how AI technology supports TEM lamella preparation, featuring an automated lift-out process that helps streamline specimen preparation. This technology improves consistency and reduces the need for manual intervention, making it suitable for laboratories looking to enhance their TEM workflows.